標題: Low-temperature direct copper-to-copper bonding enabled by creep on highly (111)-oriented Cu surfaces
作者: Liu, Chien-Min
Lin, Han-Wen
Chu, Yi-Cheng
Chen, Chih
Lyu, Dian-Rong
Chen, Kuan-Neng
Tu, K. N.
材料科學與工程學系
電子工程學系及電子研究所
Department of Materials Science and Engineering
Department of Electronics Engineering and Institute of Electronics
關鍵字: Cu-to-Cu direct bonding;Creep;Diffusion;Preferred orientation
公開日期: 1-五月-2014
摘要: We achieve low-temperature Cu-to-Cu direct bonding using highly (1 1 1)-orientated Cu films. The bonding temperature can be lowered to 200 degrees C at a stress of 114 psi for 30 min at 10(-3) torr. The temperature is lower than the reflow temperature of 250 degrees C for Pb-free solders. Our breakthrough is based on the finding that the Cu (1 1 1) surface diffusivity is the fastest among all the planes of Cu and the bonding process can occur through surface diffusion creep on the (1 1 1) surfaces. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.scriptamat.2014.01.040
http://hdl.handle.net/11536/24211
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2014.01.040
期刊: SCRIPTA MATERIALIA
Volume: 78-79
Issue: 
起始頁: 65
結束頁: 68
顯示於類別:期刊論文


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  1. 000334138900017.pdf