標題: A TSV-Based Bio-Signal Package With mu-Probe Array
作者: Chou, Lei-Chun
Lee, Shih-Wei
Huang, Po-Tsang
Chang, Chih-Wei
Chiang, Cheng-Hao
Wu, Shang-Lin
Chuang, Ching-Te
Chiou, Jin-Chern
Hwang, Wei
Wu, Chung-Hsi
Chen, Kuo-Hua
Chiu, Chi-Tsung
Tong, Ho-Ming
Chen, Kuan-Neng
交大名義發表
National Chiao Tung University
關鍵字: TSV;CMOS MEMS;bio-signal probe
公開日期: 1-二月-2014
摘要: Bio-signal probes providing stable observation with high quality signals are crucial for understanding how the brain works and how the neural signal transmits. Due to the weak and noisy characteristics of bio-signals, the connected interconnect length between the sensor and CMOS has significant impact on the bio-signal quality. In addition, long interconnections with wire bonding technique introduce noises and lead to bulky packaged systems. This letter presents an implantable through-silicon via (TSV) technology to connect sensors and CMOS devices located on the opposite sides of the chip for brain neural sensing applications. With the elimination of traditional wire bonding and packaging technologies, the quality of bio-signal can be greatly improved.
URI: http://dx.doi.org/10.1109/LED.2013.2293399
http://hdl.handle.net/11536/23811
ISSN: 0741-3106
DOI: 10.1109/LED.2013.2293399
期刊: IEEE ELECTRON DEVICE LETTERS
Volume: 35
Issue: 2
起始頁: 256
結束頁: 258
顯示於類別:期刊論文


文件中的檔案:

  1. 000331377500036.pdf