Title: Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
Authors: Wang, Chin-Te
Hsu, Li-Han
Wu, Wei-Cheng
Hsu, Heng-Tung
Chang, Edward Yi
Hu, Yin-Chu
Lee, Ching-Ting
Tsai, Szu-Ping
Department of Materials Science and Engineering
Keywords: Benzocyclobutene (BCB);flip-chip packaging;millimeter-wave;reliability;W-band
Issue Date: 1-Jan-2014
Abstract: Flip-chip package has great potential for use in millimeter-wave applications. However, the coefficient of thermal expansion mismatch between the chip and the substrate usually generates thermal stresses that fracture the flip-chip structure. The use of underfills with low dielectric loss is essential to improve the mechanical strength and reliability of the flip-chip package. Benzocyclobutene (BCB) was used in this study as the underfill material for the flip-chip structure using the no-flow process. The flip-chip structure with BCB injection provides good RF performance with a return loss of better than 18 dB and an insertion loss of 0.6 dB up to 100 GHz, in addition to a lower dielectric loss. Furthermore, thermal cycle and shear force tests show that the underfill injection can significantly improve the reliability of a flip-chip package.
URI: http://dx.doi.org/10.1109/LMWC.2013.2285213
ISSN: 1531-1309
DOI: 10.1109/LMWC.2013.2285213
Volume: 24
Issue: 1
Begin Page: 11
End Page: 13
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