標題: Investigation of the Flip-Chip Package With BCB Underfill for W-Band Applications
作者: Wang, Chin-Te
Hsu, Li-Han
Wu, Wei-Cheng
Hsu, Heng-Tung
Chang, Edward Yi
Hu, Yin-Chu
Lee, Ching-Ting
Tsai, Szu-Ping
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Benzocyclobutene (BCB);flip-chip packaging;millimeter-wave;reliability;W-band
公開日期: 1-一月-2014
摘要: Flip-chip package has great potential for use in millimeter-wave applications. However, the coefficient of thermal expansion mismatch between the chip and the substrate usually generates thermal stresses that fracture the flip-chip structure. The use of underfills with low dielectric loss is essential to improve the mechanical strength and reliability of the flip-chip package. Benzocyclobutene (BCB) was used in this study as the underfill material for the flip-chip structure using the no-flow process. The flip-chip structure with BCB injection provides good RF performance with a return loss of better than 18 dB and an insertion loss of 0.6 dB up to 100 GHz, in addition to a lower dielectric loss. Furthermore, thermal cycle and shear force tests show that the underfill injection can significantly improve the reliability of a flip-chip package.
URI: http://dx.doi.org/10.1109/LMWC.2013.2285213
http://hdl.handle.net/11536/23624
ISSN: 1531-1309
DOI: 10.1109/LMWC.2013.2285213
期刊: IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS
Volume: 24
Issue: 1
起始頁: 11
結束頁: 13
顯示於類別:期刊論文


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  1. 000329873700005.pdf