標題: A Low-Cost DC-to-84-GHz Broadband Bondwire Interconnect for SoP Heterogeneous System Integration
作者: Li, Chun-Hsing
Ko, Chun-Lin
Kuo, Chien-Nan
Kuo, Ming-Ching
Chang, Da-Chiang
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: Bondwire;broadband;heterogeneous integration;interconnect;system-on-package (SoP);transmission lines
公開日期: 1-Dec-2013
摘要: A low-cost broadband bondwire interconnect is proposed for heterogeneous system integration. Transmission lines are incorporated with bondwires to form a two-path structure, which can effectively reduce the bondwire effect. Theoretical analysis is provided using a graphical method and it shows that the interconnect can give widest operation bandwidth from dc up to a maximum frequency f(max) if the length of the transmission lines is designed at an optimal electrical length theta(max) . In particular, theta(max) only depends on the characteristic impedance of the transmission lines. The achievable f(max) is limited by the bondwire inductance, i.e., smaller bondwire inductance is preferred to have wider operation bandwidth. An interconnect from a 0.18-mu m CMOS chip to a glass-integrated-passive-device carrier is designed to verify the proposed concept. Measured results show that the insertion loss and the return loss can be better than 3.0 and 13.4 dB, respectively, from dc to 84 GHz. The proposed interconnect shows around 3.2 times bandwidth of a single bondwire alone. To the best of authors' knowledge, this work demonstrates the bondwire interconnect with the widest operation bandwidth for heterogeneous system integration by using system-on-package reported thus far.
URI: http://dx.doi.org/10.1109/TMTT.2013.2281966
http://hdl.handle.net/11536/23213
ISSN: 0018-9480
DOI: 10.1109/TMTT.2013.2281966
期刊: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume: 61
Issue: 12
起始頁: 4345
結束頁: 4352
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