標題: An electroplating method for copper plane twin boundary manufacturing
作者: Wang, Yu-Sheng
Lee, Wen-Hsi
Chang, Shih-Chieh
Nian, Jun-Nan
Wang, Ying-Lang
照明與能源光電研究所
Institute of Lighting and Energy Photonics
關鍵字: Twin boundary;Electroplating;Copper
公開日期: 1-十月-2013
摘要: A twin boundary is a special kind of grain boundary that plays an important role in the deformation process of nanocrystalline metals, as it may affect the migration of atoms and electrons in polycrystalline solids, resulting in different electrical and mechanical properties. In this study, plane twin structures were introduced into an electroplated copper film by an electroplating method that inserts an interlayer film with a very small current density (<3 mA/cm(2)). It was found that the small-current interlayer formed a demarcation line for copper grain growth, and enhanced the twin boundaries by self-annealing at room temperature. Based on this, a method was developed to manufacture multi-plane twin boundaries to improve electron migration. Transmission electron microscopy, focused ion beam analysis, and secondary ion mass spectrometry were employed to examine this interesting phenomenon. (C) 2013 Elsevier B. V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.tsf.2013.03.131
http://hdl.handle.net/11536/22730
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2013.03.131
期刊: THIN SOLID FILMS
Volume: 544
Issue: 
起始頁: 157
結束頁: 161
顯示於類別:期刊論文


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