Title: An electroplating method for copper plane twin boundary manufacturing
Authors: Wang, Yu-Sheng
Lee, Wen-Hsi
Chang, Shih-Chieh
Nian, Jun-Nan
Wang, Ying-Lang
照明與能源光電研究所
Institute of Lighting and Energy Photonics
Keywords: Twin boundary;Electroplating;Copper
Issue Date: 1-Oct-2013
Abstract: A twin boundary is a special kind of grain boundary that plays an important role in the deformation process of nanocrystalline metals, as it may affect the migration of atoms and electrons in polycrystalline solids, resulting in different electrical and mechanical properties. In this study, plane twin structures were introduced into an electroplated copper film by an electroplating method that inserts an interlayer film with a very small current density (<3 mA/cm(2)). It was found that the small-current interlayer formed a demarcation line for copper grain growth, and enhanced the twin boundaries by self-annealing at room temperature. Based on this, a method was developed to manufacture multi-plane twin boundaries to improve electron migration. Transmission electron microscopy, focused ion beam analysis, and secondary ion mass spectrometry were employed to examine this interesting phenomenon. (C) 2013 Elsevier B. V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.tsf.2013.03.131
http://hdl.handle.net/11536/22730
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2013.03.131
Journal: THIN SOLID FILMS
Volume: 544
Issue: 
Begin Page: 157
End Page: 161
Appears in Collections:Articles


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