標題: Effect of Au thickness on laser beam penetration in semiconductor laser packages
作者: Cheng, WH
Wang, SC
Yang, YD
Chi, S
Sheen, MT
Kuang, JH
光電工程學系
Department of Photonics
關鍵字: Au coating;finite-element method;laser welding;optoelectronic packaging
公開日期: 1-十一月-1997
摘要: Comprehensive measurements of the dependence of the weld width, penetration depth, and joint strength on the Au coating thickness in laser welding techniques for semiconductor laser packages are presented. The results obtained from the Invar-Invar joints show that the welded joints with thick Au coating exhibit narrower weld width, shallower penetration, and hence less joint strength than those the package joints with thin Au coating, A finite-element method (FEM) has been carried out on the effect of Au thickness on laser beam penetration in Invar-Invar joints, This method has been employed successfully Po predict the laser beam penetration in laser welded An-coated materials that the weld width and the penetration depth are reduced as the Au coating thickness increases, The likely cause for the reduction is the increased thermal conduction of thicker Au in the welded region, in addition to Au coating, the effect of Ni coating on laser beam penetration is also presented, Detailed knowledge of the effect of;in coating thickness on laser beam penetration is important for the practical design and fabrication of reliable optoelectronic packaging having laser welded Au-coated materials.
URI: http://dx.doi.org/10.1109/96.641507
http://hdl.handle.net/11536/227
ISSN: 1070-9894
DOI: 10.1109/96.641507
期刊: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING
Volume: 20
Issue: 4
起始頁: 396
結束頁: 402
顯示於類別:期刊論文


文件中的檔案:

  1. A1997YD59000005.pdf