Title: Investigation the Electroplating Behavior of Self Formed CuMn Barrier
Authors: Wu, Chia-Yang
Lee, Wen-Hsi
Chang, Shih-Chieh
Wang, Ying-Lang
Institute of Lighting and Energy Photonics
Keywords: Self-Formed;CuMn;EIS
Issue Date: 1-Aug-2013
Abstract: The electrical and material properties of Copper (Cu) mixed with [0 similar to 10 atomic% manganese (Mn)] and pure Cu films deposited on silicon oxide (SiO2)/silicon (Si) are explored. Cu electroplating on self formed CuMn barrier was investigated with different Mn content. The electrochemical deposition of the Cu thin film onto the electrode using CuMn barrier was investigated. Scanning electron microscopic (SEM) micrographs of copper electroplating on CuMn films were examined, and the copper nucleation behaviors changed with the Mn content. Since the electrochemical impedance spectroscopy (EIS) is widely recognized as a powerful tool for the investigation of electrochemical behaviors, the tool was also used to verify the phenomena during plating. It was found that the charge-trasfer impedance decrease with the rise in the Mn content below 5%, but increase with the rise in the Mn content higher than 5%. The result was corresponded to the surface energy, the surface morphology, the corrosion and the oxidation of the substrate.
URI: http://dx.doi.org/10.1166/jnn.2013.6795
ISSN: 1533-4880
DOI: 10.1166/jnn.2013.6795
Volume: 13
Issue: 8
Begin Page: 5800
End Page: 5806
Appears in Collections:Articles