標題: Microstructure control of unidirectional growth of eta-Cu6Sn5 in microbumps on < 1 1 1 > oriented and nanotwinned Cu
作者: Lin, Han-wen
Lu, Chia-ling
Liu, Chien-min
Chen, Chih
Chen, Delphic
Kuo, Jui-Chao
Tu, K. N.
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Intermetallic compounds;Soldering;Copper
公開日期: 1-Aug-2013
摘要: Anisotropic microstructure is becoming a critical issue in microbumps used in 3-D integrated circuit packaging. We report here an experimental approach for controlling the microstructure of eta-Cu6Sn5 intermetallic compound in microbumps by using < 1 1 1 > oriented and nanotwinned Cu pads as the under-bump-metallization. By electroplating arrays of large numbers of < 1 1 1 > oriented and nanotwinned Cu pads and by electroplating the Sn2.3Ag solder on the pads, we form eta-Cu6Sn5 in the reflow at 260 degrees C for 1 min. The eta-Cu6Sn5 showed a highly preferential growth along the < 0 0 0 1 > direction. As reflow time is extended, the preferred texture of eta-Cu6Sn5 changed to {2 (1) over bar (1) over bar 3}. The results indicate that we can control the uniform microstructure of eta-Cu6Sn5 intermetallic by controlling the microstructure of the Cu under-bump-metallization. (C) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.actamat.2013.04.056
http://hdl.handle.net/11536/22157
ISSN: 1359-6454
DOI: 10.1016/j.actamat.2013.04.056
期刊: ACTA MATERIALIA
Volume: 61
Issue: 13
起始頁: 4910
結束頁: 4919
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