|標題:||Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints|
|作者:||Liang, Y. C.|
Lin, H. W.
Chen, H. P.
Tu, K. N.
Lai, Y. S.
Department of Materials Science and Engineering
|關鍵字:||Stress migration;Diffusion;Temperature cycling test;SnPb composite solder joint|
|摘要:||The evolution of eutectic structure under temperature cycling tests (TCTs) in SnPb composite solder joints has been investigated. After 500 cycles of TCT, the Sn grains coarsened and developed anisotropic stripes close to the necking site in the solder joint because of stress-induced atomic migration. Then, cracks triggered by thermal stress were observed to propagate along the Sn stripe interfaces. After a prolonged 14,410 cycles of TCT, the cracks expanded across the entire solder joint and led to electrical open failure. (c) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.|
|Appears in Collections:||Articles|
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