標題: Electromigration study of eutectic SnPb flip-chip solder joints on ceramic substrates
作者: Lin, C. K.
Chen, Chih
Yu, H. M.
Lan, J. K.
Lee, D. L.
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 2008
摘要: This study investigates electromigration Study of eutectic SnPb flip-chip solder joints on ceramic substrates. The under bump metallization (UBM) structure consist,; of 5-mu m Cu / 3-mu m Ni under bump metallization (UBM). Under the current stressing by 0.9A tit 150 degrees C, we did not find void formation but a large amount of intermetallic compound (IMC) of Cu(6)(Sn, Ni)(5) were fornied when the bump resistance increased 10 m Omega. Three-dimensional electrical Simulation by finite element analysis was carried out to simulate the current density distribution in solder joints with slit Cu traces. It is found that the current density was almost uniformly distributed in solder joint for this structure. It is found that the bump resistance only increases 0.07m Omega when half of the solder bump was transformed into Cu(6)Sn(5) IMC. The reason for the low crowding effect in the solder joints will be discussed in the conference.
URI: http://hdl.handle.net/11536/2152
http://dx.doi.org/10.1109/EMAP.2008.4784278
ISBN: 978-1-4244-3619-4
DOI: 10.1109/EMAP.2008.4784278
期刊: 2008 EMAP CONFERENCE PROCEEDINGS
起始頁: 259
結束頁: 261
顯示於類別:會議論文


文件中的檔案:

  1. 000264237400060.pdf