標題: Eliminate Kirkendall voids in solder reactions on nanotwinned copper
作者: Liu, Tao-Chi
Liu, Chien-Min
Huang, Yi-Sa
Chen, Chih
Tu, King-Ning
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Kirkendall voids;Twinning;Copper;Nanostructured materials;Diffusion
公開日期: 1-三月-2013
摘要: Electroplating was used to fabricate a high density of nanotwins that exhibited the preferred (111) orientation in Cu. We found no formation of Kirkendall voids in solder reactions on the nanotwinned Cu. This was due to the high density of steps and kinks on the nanotwin boundaries, which serve as vacancy sinks. Thus the vacancy concentration cannot reach supersaturation and nucleate voids. The finding is a significant advance in the problem of solder joint reliability in microelectronic three-dimensional integrated circuit devices. (c) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.scriptamat.2012.10.024
http://hdl.handle.net/11536/21014
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2012.10.024
期刊: SCRIPTA MATERIALIA
Volume: 68
Issue: 5
起始頁: 241
結束頁: 244
顯示於類別:期刊論文


文件中的檔案:

  1. 000314012000005.pdf