標題: Novel EBSD preparation method for Cu/Sn microbumps using a focused ion beam
作者: Liu, Tao-Chi
Chen, Chih
Chiu, Kuo-Jung
Lin, Han-Wen
Kuo, Jui-Chao
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Focused ion beam (FIB);Intermetallic compound;Sample preparation;Image quality;Electron backscatter diffraction (EBSD)
公開日期: 1-Dec-2012
摘要: We proposed a novel technique developed from focused ion beam (FIB) polishing for sample preparation of electron backscatter diffraction (EBSD) measurement. A low-angle incident gallium ion beam with a high acceleration voltage of 30 kV was used to eliminate the surface roughness of cross-sectioned microbumps resulting from mechanical polishing. This work demonstrates the application of the FIB polishing technique to solders for a high-quality sample preparation for EBSD measurement after mechanical polishing. (C) 2012 Elsevier Inc. All rights reserved.
URI: http://dx.doi.org/10.1016/j.matchar.2012.09.002
http://hdl.handle.net/11536/20865
ISSN: 1044-5803
DOI: 10.1016/j.matchar.2012.09.002
期刊: MATERIALS CHARACTERIZATION
Volume: 74
Issue: 
起始頁: 42
結束頁: 48
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