Full metadata record
DC FieldValueLanguage
dc.contributor.authorCHEN, TPen_US
dc.contributor.authorLEI, TFen_US
dc.contributor.authorCHANG, CYen_US
dc.contributor.authorHSIEH, WYen_US
dc.contributor.authorCHEN, LJen_US
dc.date.accessioned2014-12-08T15:03:21Z-
dc.date.available2014-12-08T15:03:21Z-
dc.date.issued1995-06-01en_US
dc.identifier.issn0013-4651en_US
dc.identifier.urihttp://hdl.handle.net/11536/1889-
dc.description.abstractThe behaviors of fluorine in BF2+ implanted polycrystalline silicon (poly-Si) on silicon have been investigated in the annealing temperature range of 850 to 1100 degrees C. The distribution of fluorine atoms as functions of temperature and time have been monitored by the secondary ion mass spectroscopy (SIMS) and cross-sectional transmission electron microscopy (XTEM). The XTEM micrographs revealed that fluorine bubbles are distributed in the poly-Si and at the original poly-Si/Si interface after annealing. The locations of bubbles were found to correspond to the fluorine peaks in the SIMS depth-concentration profiles. The presence of the boron peak at the original poly-Si/Si interface is attributed to the gettering of boron atoms by the fluorine bubbles. Moreover, the boron profiles in the silicon substrates are sensitive to thermal budget due to the pileup of fluorine atoms at the poly-Si/Si interface. The pileup of fluorine at the poly-Si/Si interface leads to an enhancement of epitaxial regrowth of poly-Si films and. the formation of fluorine bubbles. Consequently higher surface dopant concentration and deeper junction depth were obtained.en_US
dc.language.isoen_USen_US
dc.titleINVESTIGATION ON THE DISTRIBUTION OF FLUORINE AND BORON IN POLYCRYSTALLINE SILICON SILICON SYSTEMSen_US
dc.typeArticleen_US
dc.identifier.journalJOURNAL OF THE ELECTROCHEMICAL SOCIETYen_US
dc.citation.volume142en_US
dc.citation.issue6en_US
dc.citation.spage2000en_US
dc.citation.epage2006en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:A1995RC28900057-
dc.citation.woscount17-
Appears in Collections:Articles


Files in This Item:

  1. A1995RC28900057.pdf