標題: METALLURGICAL REACTIONS AT THE INTERFACE OF SN/PB SOLDER AND ELECTROLESS COPPER-PLATED ALN SUBSTRATE
作者: CHIOU, BS
CHANG, JH
DUH, JG
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-八月-1995
摘要: Intermetallic formation between electroless-plated copper and Sn/Pb solder is investigated. An interlayer is formed between copper and solder, and segregation of Pb-rich and Sn-rich phases are observed. X-ray diffraction and EDX analysis results suggest that the major intermetallic formed in the interlayer is Cu6Sn5. For the as-plated sample, the adhesion strength of Cu to the AIN substrate after 150 degrees C aging is affected by both the recrystallization and the creep of copper. For the soldered specimen, the presence of intermetallic compound causes cracks to propagate along the intermetallic/Cu interface and results in a decrease of the adhesion strength.
URI: http://hdl.handle.net/11536/1802
ISSN: 1070-9894
期刊: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING
Volume: 18
Issue: 3
起始頁: 537
結束頁: 542
顯示於類別:期刊論文


文件中的檔案:

  1. A1995RN87900019.pdf