|標題:||Joule heating effect under accelerated electromigration in flip-chip solder joints|
|作者:||Chiu, S. H.|
Liang, S. W.
Yao, D. J.
Department of Materials Science and Engineering
|摘要:||This study employs three-dimensional simulation to investigate the Joule heating effect under accelerated electromigration tests in flip-chip solder joints. It was found that the Joule heating effect was very seriously during high current stressing, and a hot spot exists in the solder bump. The hot-spot may play important role in the void formation and thermomigration in solder bumps during electromigration.|
|期刊:||56th Electronic Components & Technology Conference 2006, Vol 1 and 2, Proceedings|
|Appears in Collections:||Conferences Paper|
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