Title: Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints
Authors: Guo, Ming-Yung
Lin, C. K.
Chen, Chih
Tu, K. N.
材料科學與工程學系
Department of Materials Science and Engineering
Keywords: Intermetallics;miscellaneous;Diffusion;Thermal properties;Joining
Issue Date: 1-Oct-2012
Abstract: We observed asymmetrical growth of Cu6Sn5 intermetallic compounds (IMCs) on the two interfaces of Cu/SnAg/Cu solder joints during reflow at 260 degrees C on a hot plate. The IMCs grew to 12.3 mu m on the cold end and 3.5 mu m on the hot end after reflow for 40 min. However, the consumption of Cu on the cold end is less than that on the hot end. We propose that rapid thermomigration of Cu is responsible for the asymmetrical growth of the IMCs. With the simulated thermal gradient of 51 degrees C/cm across the liquid solder, the heat of transport of Cu is calculated as 20 kJ/mol. (C) 2012 Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.intermet.2012.06.003
http://hdl.handle.net/11536/16842
ISSN: 0966-9795
DOI: 10.1016/j.intermet.2012.06.003
Journal: INTERMETALLICS
Volume: 29
Issue: 
Begin Page: 155
End Page: 158
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