標題: Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish
作者: Chu, Ming-Hui
Liang, S. W.
Chen, Chih
Huang, Annie T.
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Electromigration;solder joints
公開日期: 1-九月-2012
摘要: "Organic solderable preservative (OSP) has been adopted as the Cu substrate surface finish in flip-chip solder joints for many years. In this study, the electromigration behavior of lead-free Sn-Cu solder alloys with thin-film under bump metallization and OSP surface finish was investigated. The results showed that severe damage occurred on the substrate side (cathode side), whereas the damage on the chip side (cathode side) was not severe. The damage on the substrate side included void formation, copper dissolution, and formation of intermetallic compounds (IMCs). The OSP Cu interface on the substrate side became the weakest point in the solder joint even when thin-film metallization was used on the chip side. Three-dimensional simulations were employed to investigate the current density distribution in the area between the OSP Cu surface finish and the solder. The results indicated that the current density was higher along the periphery of the bonding area between the solder and the Cu pad, consistent with the area of IMC and void formation in our experimental results."
URI: http://hdl.handle.net/11536/16715
ISSN: 0361-5235
期刊: JOURNAL OF ELECTRONIC MATERIALS
Volume: 41
Issue: 9
結束頁: 2502
顯示於類別:期刊論文


文件中的檔案:

  1. 000307289400029.pdf