標題: Temperature cycling effects between Sn/Pb solder and electroless copper plated AIN substrate
作者: Chiou, BS
Chang, JH
Duh, JG
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-十二月-1995
摘要: Thermal cycling effects on Sn/Pb solder and electroless Cu-plated AIN substrates are investigated. X-ray diffraction patterns reveal the existence of Cu2O for the electroless Cu-plated AIN after thermal cycling in an environmental chamber. Moisture in the chamber results in the oxidation of electroless plated Cu and fracture takes place at the Cu2O/Cu interface. The oxidation of Cu is also confirmed by Auger depth profile and electrical sheet resistance measurement. For the solder/Cu/AIN system, fracture occurs at the Cu/solder interface. No intermetallic compounds between solder and Cu are found after thermal cycling. Stress resulting from the thermal expansion mismatch is the major cause of loss of adhesion.
URI: http://hdl.handle.net/11536/1631
ISSN: 0957-4522
期刊: JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
Volume: 6
Issue: 6
起始頁: 375
結束頁: 379
顯示於類別:期刊論文


文件中的檔案:

  1. A1995TK73600002.pdf