標題: Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper
作者: Hsiao, Hsiang-Yao
Liu, Chien-Min
Lin, Han-Wen
Liu, Tao-Chi
Lu, Chia-Ling
Huang, Yi-Sa
Chen, Chih
Tu, K. N.
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 25-May-2012
摘要: Highly oriented [111] Cu grains with densely packed nanotwins have been fabricated by direct-current electroplating with a high stirring rate. The [111]-oriented and nanotwinned Cu (nt-Cu) allow for the unidirectional growth of Cu6Sn5 intermetallics in the microbumps of three-dimensional integrated-circuit packaging; a uniform microstructure in a large number of microbumps of controlled orientation can be obtained. The high-density twin boundaries in the nt-Cu serve as vacancy sinks during the solid-state reaction between Pb-free solder and Cu and greatly reduce the formation of Kirkendall (or Frenkel) voids.
URI: http://hdl.handle.net/11536/16300
ISSN: 0036-8075
期刊: SCIENCE
Volume: 336
Issue: 6084
結束頁: 1007
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