標題: The effect of a concentration gradient on interfacial reactions in microburaps of Ni/SnAg/Cu during liquid-state soldering
作者: Huang, Y. S.
Hsiao, H. Y.
Chen, Chih
Tu, K. N.
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Diffusion;Intermetallic;compounds;Soldering;Copper;Nickel
公開日期: 1-五月-2012
摘要: We report new findings in Ni/SnAg solder/Cu microbumps having a reduced solder thickness in the range of 40-10 mu m; the growth rate of the intermetallic compounds depends strongly on the solder thickness. In the Ni/40 mu m solder/Cu samples., the compound which grew on the Ni side grew slightly faster than that on the Cu side. However, the growth reverses as the solder thickness decreases below 20 pm due to the change in Cu and Ni concentration gradients in the solder. (C) 2012 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI: http://hdl.handle.net/11536/16017
ISSN: 1359-6462
期刊: SCRIPTA MATERIALIA
Volume: 66
Issue: 10
結束頁: 741
顯示於類別:期刊論文


文件中的檔案:

  1. 000302756400006.pdf