標題: Investigation of the Galvanic Effect between RuN Barriers and Cu Seed Layers
作者: Wu, Chia-Yang
Lee, Wen-Hsi
Chang, Shih-Chieh
Wang, Ying-Lang
照明與能源光電研究所
Institute of Lighting and Energy Photonics
公開日期: 1-十二月-2011
摘要: In this study, we investigated the galvanic effect between the Cu metals and ruthenium nitride (RuNx) films that were deposited at various nitrogen (N-2) gas flow rates in chemical mechanical polishing slurries. It was found that the galvanic corrosion of the RuNx films was inhibited with increasing N-2 gas flow ratio, whereas the galvanic corrosion of the Cu seed layers was enhanced. Electrochemical impedance spectroscopy showed that the galvanic corrosion resistance of RuNx increased and that of the ruthenium oxide layer decreased as N-2 flow ratio increased. This was because the increase in the N content in the RuNx films inhibited the corrosion and oxidation of the Ru metals. (C) 2011 The Japan Society of Applied Physics
URI: http://dx.doi.org/10.1143/JJAP.50.121803
http://hdl.handle.net/11536/15718
ISSN: 0021-4922
DOI: 10.1143/JJAP.50.121803
期刊: JAPANESE JOURNAL OF APPLIED PHYSICS
Volume: 50
Issue: 12
結束頁: 
顯示於類別:期刊論文


文件中的檔案:

  1. 000300707400026.pdf