標題: Stress Gradient Modification of the Electroplated Ni-Diamond Nanocomposite for MEMS Fabrication
作者: Lee, Yi-Chia
Cheng, Yu-Ting
Hsu, Wensyang
機械工程學系
電子工程學系及電子研究所
Department of Mechanical Engineering
Department of Electronics Engineering and Institute of Electronics
公開日期: 2012
摘要: The paper investigates the formation of stress gradient in electroplated Ni-based nanocomposite films and presents a process scheme to effectively reduce the stress by lowering plating current density. The stress gradient is characterized by measuring the radius of curvature from the surface profile of Ni-based micro-cantilever beams. For the case of the Ni-based films plated with the current density from 15.3 down to 0.8 mA/cm(2), the stress gradient of the films is formed in the range of -7.13 to -3.23 MPa/mu m. According to the cross sectional SEM images, it is found that the Ni-based film plated with 0.8 mA/cm(2) can have a uniformly distributed grain size that can result in a lower stress gradient. By lowering the plating current density from 15.3 to 0.8 mA/cm(2), about 41% and 21% of the stress gradient reduction can be realized in the Ni and Ni-diamond nanocomposite films, respectively, which can be utilized for MEMS resonator fabrication without having structural warpage. Furthermore, experimental results show that the performance of the Ni-diamond nanocomposite resonator can be enhanced in terms of the increase of resonant frequency and quality factor. (C) 2012 The Electrochemical Society. [DOI: 10.1149/2.002205jes] All rights reserved.
URI: http://hdl.handle.net/11536/15706
http://dx.doi.org/10.1149/2.002205jes
ISSN: 0013-4651
DOI: 10.1149/2.002205jes
期刊: JOURNAL OF THE ELECTROCHEMICAL SOCIETY
Volume: 159
Issue: 4
起始頁: H460
結束頁: H466
顯示於類別:期刊論文


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  1. 000300488300101.pdf