標題: Design, Fabrication, and Reliability of Low-Cost Flip-Chip-On-Board Package for Commercial Applications up to 50 GHz
作者: Hsu, Li-Han
Oh, Chee-Way
Wu, Wei-Cheng
Chang, Edward Yi
Zirath, Herbert
Wang, Chin-Te
Tsai, Szu-Ping
Lim, Wee-Chin
Lin, Yueh-Chin
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Coplanar waveguide;fabrication;flip-chip-on-board;interconnect;metamorphic high-electron-mobility transistor device;microwave;packaging;reliability;RO3210 laminate;underfill
公開日期: 1-三月-2012
摘要: This paper presents a flip-chip-on-board (FCOB) packaging technology using a Rogers RO3210 laminate for microwave applications. Compared to the conventional microwave packaging architecture, the proposed FCOB technology skips one level of the ceramic package and thus results in lower reflections and manufacturing costs. To fulfill the small dimension requirement on printed circuit boards, the coplanar waveguide (CPW) transmission line and flip-chip bump were fabricated on a high-k RO3210 board (epsilon(r) = 10.2) with photolithography and electroplating. The GaAs chip patterned with the CPW line was then flip-chip-mounted onto the RO3210 laminate board. This structure displayed excellent performance from dc to 50 GHz with a return loss S-11 greater than 18 dB and insertion loss S-21 less than 0.5 dB. Meanwhile, the flip-chip bonding of the in-house-fabricated In0.52Al0.As-48/In0.6Ga0.4As metamorphic high-electron-mobility transistor devices on RO3210 also displayed excellent gain performance with a small degradation of 1 dB from dc to 40 GHz, showing the potential of implementing microwave integrated circuits on RO3210. To enhance the mechanical reliability, an epoxy-based underfill was injected into the flip-chip assemblies. Thermal cycling tests were performed to test the interconnect reliability, and the results indicated that the samples passed the thermal cycling test at least up to 600 cycles, showing excellent reliability for commercial applications. To the best of the authors' knowledge, this is the first study that evaluates the use of the RO3210 laminate for microwave flip-chip in open literature.
URI: http://dx.doi.org/10.1109/TCPMT.2011.2171485
http://hdl.handle.net/11536/15583
ISSN: 2156-3950
DOI: 10.1109/TCPMT.2011.2171485
期刊: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
Volume: 2
Issue: 3
起始頁: 402
結束頁: 409
顯示於類別:期刊論文


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  1. 000301237100006.pdf