標題: Wafer-level Cu-Cu bonding technology
作者: Tang, Ya-Sheng
Chang, Yao-Jen
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
公開日期: 1-Feb-2012
摘要: Semiconductor industry currently utilizes copper wafer bonding as one of key technologies for 3D integration. This review paper describes both science and technology of copper wafer bonding with regard to present applications. The classification of Cu bonding, bonding mechanisms, process developments, its microstructure evolution, as well as other characterizations are reviewed. Researches about patterned Cu bonding, future prospects, and 3D integration using Cu bonding are discussed in this paper. (C) 2011 Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.microrel.2011.04.016
http://hdl.handle.net/11536/15219
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2011.04.016
期刊: MICROELECTRONICS RELIABILITY
Volume: 52
Issue: 2
起始頁: 312
結束頁: 320
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