Title: Low temperature bonding technology for 3D integration
Authors: Ko, Cheng-Ta
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
Issue Date: 1-Feb-2012
Abstract: 3D integration provides a promising solution to achieve system level integration with high function density, small form factor, enhanced transmission speed and low power consumption. Stacked bonding is the key technology to enable the communication between different strata of the 3D integration system. Low temperature bonding approaches are explored in industry to solve the performance degradation issue of the integrated devices. In this paper, various low temperature bonding technologies are reviewed and introduced, as well as the latest developments in world-wide companies and research institutes. The outlook for industrial application is also addressed in the paper. (C) 2011 Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.microrel.2011.03.038
http://hdl.handle.net/11536/15218
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2011.03.038
Journal: MICROELECTRONICS RELIABILITY
Volume: 52
Issue: 2
Begin Page: 302
End Page: 311
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