標題: Effect of TiO2 on thermal and adhesive characteristics of poly(imide siloxane)/TiO2 hybrid films
作者: Ko, Cheng-Jung
Tseng, I-Hsiang
Whang, Wha-Tzong
Tsai, Mei-Hui
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: poly(imide siloxane);TiO2;X-ray photoelectron spectroscopy;adhesion;copper foil
公開日期: 5-五月-2012
摘要: A novel poly(imide siloxane)/titania (PIS/TiO2) hybrid film was fabricated by sol-gel process via in situ formation of TiO2 within PIS matrix. Poly(amic acid siloxane) (PAAS) was prepared from 4,4'-oxydiphthalic anhydride, 2,2-bis [4-(4-aminophenoxy) phenyl] propane, and alpha,omega-bis(3-aminopropyl)polydimethylsiloxane (APPS). Chelating agent, acetylacetone, and catalyst-free polymerization were used to reduce the rate of hydrolysis of titanium alkoxide in the PAAS. X-ray photoelectron spectroscopy data showed that the presence of APPS promotes the Ti surface composition of PIS/TiO2 hybrid film. The effects of TiO2 and APPS contents on the characteristics of surface, thermostability, coefficient of thermal expansion (CTE), and the strength of adhesion were investigated. The presence of TiO2 on the surface of the hybrid films enhanced the adhesive strength at the interface of PIS/TiO2 hybrid film and copper foil. When more TiO2 was incorporated into the PIS matrix, the PIS/TiO2 hybrid film exhibited lower CTE while retaining favorable mechanical and thermal properties. (C) 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012
URI: http://dx.doi.org/10.1002/app.34649
http://hdl.handle.net/11536/15198
ISSN: 0021-8995
DOI: 10.1002/app.34649
期刊: JOURNAL OF APPLIED POLYMER SCIENCE
Volume: 124
Issue: 3
起始頁: 1929
結束頁: 1937
顯示於類別:期刊論文


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  1. 000299831900021.pdf