標題: Diffusion barrier characteristics and shear fracture behaviors of eutectic PbSn solder/electroless Co(W,P) samples
作者: Pan, Hung-Chun
Hsieh, Tsung-Eong
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Electroless Co(W,P);IMC;Diffusion barrier;Shear test
公開日期: 25-一月-2012
摘要: Diffusion barrier characteristics, activation energy (E(a)) of IMC growth and bonding properties of amorphous and polycrystalline electroless Co(W,P) (termed as alpha-Co(W,P) and poly-Co(W,P)) to eutectic PbSn solder are presented. Intermetallic compound (IMC) spallation and an nano-crystalline P-rich layer were observed in PbSn/alpha-Co(W,P) samples subjected to liquid-state aging at 250 degrees C. In contrast, IMCs resided on the P-rich layer in PbSn/alpha-Co(W,P) samples subjected to solid-state aging at 150 degrees C. Thick IMCs neigh-boring to an amorphous W-rich layer was seen in PbSn/poly-Co(W,P) samples regardless of the aging type. alpha-Co(W,P) was found to be a sacrificial- plus stuffed-type barrier while poly-Co(W,P) is mainly a sacrificial-type barrier. The values of E(a)'s for PbSn/alpha-Co(W,P) and PbSn/poly-Co(W,P) systems were 338.6 and 167.5 kJ/mol, respectively. Shear test revealed the ductile mode dominates the failure in both alpha- and poly-Co(W,P) samples. Analytical results indicated the high P content in electroless layer might enhance the barrier capability but degrade the bonding strength. (C) 2011 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.mseb.2011.09.037
http://hdl.handle.net/11536/15010
ISSN: 0921-5107
DOI: 10.1016/j.mseb.2011.09.037
期刊: MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS
Volume: 177
Issue: 1
起始頁: 61
結束頁: 68
顯示於類別:期刊論文


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  1. 000298775500010.pdf