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dc.contributor.authorHsiao, H. -Y.en_US
dc.contributor.authorHu, C. -C.en_US
dc.contributor.authorGuo, M. -Y.en_US
dc.contributor.authorChen, C.en_US
dc.contributor.authorTu, K. N.en_US
dc.date.accessioned2014-12-08T15:20:40Z-
dc.date.available2014-12-08T15:20:40Z-
dc.date.issued2011-11-01en_US
dc.identifier.issn1359-6462en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.scriptamat.2011.08.008en_US
dc.identifier.urihttp://hdl.handle.net/11536/14700-
dc.description.abstractAn effective approach to inhibiting the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu is reported. By depositing a very thin layer of solder on Cu, followed by a 10-min reflow, the scallop-type morphology of interfacial Cu(6)Sn(5) inter-metallic compounds (IMC) became flat, and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMC was retarded. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectIntermetallic compounden_US
dc.subjectSolderingen_US
dc.subjectDiffusionen_US
dc.subject3D-IC packagingen_US
dc.titleInhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cuen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.scriptamat.2011.08.008en_US
dc.identifier.journalSCRIPTA MATERIALIAen_US
dc.citation.volume65en_US
dc.citation.issue10en_US
dc.citation.spage907en_US
dc.citation.epage910en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000296002900015-
dc.citation.woscount5-
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