標題: Inhibiting the consumption of Cu during multiple reflows of Pb-free solder on Cu
作者: Hsiao, H. -Y.
Hu, C. -C.
Guo, M. -Y.
Chen, C.
Tu, K. N.
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Intermetallic compound;Soldering;Diffusion;3D-IC packaging
公開日期: 1-十一月-2011
摘要: An effective approach to inhibiting the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu is reported. By depositing a very thin layer of solder on Cu, followed by a 10-min reflow, the scallop-type morphology of interfacial Cu(6)Sn(5) inter-metallic compounds (IMC) became flat, and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMC was retarded. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.scriptamat.2011.08.008
http://hdl.handle.net/11536/14700
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2011.08.008
期刊: SCRIPTA MATERIALIA
Volume: 65
Issue: 10
起始頁: 907
結束頁: 910
顯示於類別:期刊論文


文件中的檔案:

  1. 000296002900015.pdf