標題: NUMANA: A Hybrid Numerical and Analytical Thermal Simulator for 3-D ICs
作者: Lee, Yu-Min
Wu, Tsung-Heng
Huang, Pei-Yu
Yang, Chi-Ping
交大名義發表
National Chiao Tung University
公開日期: 1-Jan-2013
摘要: By combining analytical and numerical simulation techniques, this work develops a hybrid thermal simulator, NUMANA, which can effectively deal with complicated material structures, to estimate the temperature profile of a 3-D IC. Compared with a commercial tool, ANSYS, its maximum relative error is only 1.84%. Compared with a well known linear system solver, SuperLU [1], it can achieve orders of magnitude speedup.
URI: http://hdl.handle.net/11536/146840
ISSN: 1530-1591
期刊: DESIGN, AUTOMATION & TEST IN EUROPE
起始頁: 1379
結束頁: 1384
Appears in Collections:Conferences Paper