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dc.contributor.authorPan, Chi-Wenen_US
dc.contributor.authorLee, Yu-Minen_US
dc.contributor.authorHuang, Pei-Yuen_US
dc.contributor.authorYang, Chi-Pingen_US
dc.contributor.authorLin, Chang-Tzuen_US
dc.contributor.authorLee, Chia-Hsinen_US
dc.contributor.authorChou, Yung-Faen_US
dc.contributor.authorKwai, Ding-Mingen_US
dc.date.accessioned2018-08-21T05:56:36Z-
dc.date.available2018-08-21T05:56:36Z-
dc.date.issued2013-01-01en_US
dc.identifier.issn2153-6961en_US
dc.identifier.urihttp://hdl.handle.net/11536/146405-
dc.description.abstractThis work presents an iterative look-up table based thermal simulator, I-LUTSim, to efficiently estimate the temperature profile of three-dimensional integrated circuits. I-LUTSim includes two stages. First, the pre-process stage constructs thermal impulse response tables. Then, the simulation stage iteratively calculates the temperature profile via the table lookup. With this two-stage scheme, the maximum absolute error of I-LUTSim is less than 0.41% compared with that of a commercial tool ANSYS. Moreover, I-LUTSim is at least an order of magnitude faster than a fast matrix solver SuperLU [1] for the full-chip temperature simulation.en_US
dc.language.isoen_USen_US
dc.titleI-LUTSim: An Iterative Look-Up Table Based Thermal Simulator for 3-D ICsen_US
dc.typeProceedings Paperen_US
dc.identifier.journal2013 18TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC)en_US
dc.citation.spage151en_US
dc.citation.epage156en_US
dc.contributor.department電信工程研究所zh_TW
dc.contributor.departmentInstitute of Communications Engineeringen_US
dc.identifier.wosnumberWOS:000394457400040en_US
Appears in Collections:Conferences Paper