標題: A Novel Sealing Redistribution Layer Approach for Through-Glass via Fabrication
作者: Lee, Shih-Wei
Chang, Geng-Ming
Chang, Ching-Yun
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: Through-Glass via (TGV);redistribution layer;glass interposer;3D integration
公開日期: 1-Mar-2017
摘要: A sealing redistribution layer (RDL) approach for the interposer fabrication is developed to simplify the conventional bottom-up process flow. By using this approach, bottom-up plating can achieve the integration of Cu-filler plating and its bottom RDL simultaneously. In this paper, through-glass via in glass interposer or 3-D integration is fabricated using the proposed approach. The electrical measurement and reliability tests indicate that the proposed approach can be an attractive candidate for interposer fabrication with great performance.
URI: http://dx.doi.org/10.1109/JEDS.2017.2649605
http://hdl.handle.net/11536/145453
ISSN: 2168-6734
DOI: 10.1109/JEDS.2017.2649605
期刊: IEEE JOURNAL OF THE ELECTRON DEVICES SOCIETY
Volume: 5
Issue: 2
起始頁: 132
結束頁: 135
Appears in Collections:Articles