標題: Efficient Heat Dissipation of Uncooled 400-Gbps (16x25-Gbps) Optical Transceiver Employing Multimode VCSEL and PD Arrays
作者: Shih, Tien-Tsorng
Chi, Yu-Chieh
Wang, Ruei-Nian
Wu, Chao-Hsin
Huang, Jian-Jang
Jou, Jau-Ji
Lee, Tai-Cheng
Kuo, Hao-Chung
Lin, Gong-Ru
Cheng, Wood-Hi
光電工程學系
Department of Photonics
公開日期: 18-Apr-2017
摘要: An effective heat dissipation of uncooled 400-Gbps (16x25-Gbps) form-factor pluggable (CDFP) optical transceiver module employing chip-on-board multimode 25-Gbps vertical-surface-emitting-laser (VCSEL) and 25-Gbps photodiode (PD) arrays mounted on a brass metal core embedded within a printed circuit board (PCB) is proposed and demonstrated. This new scheme of the hollow PCB filling with thermally-dissipated brass metal core was simulated and used for high temperature and long term stability operation of the proposed 400-Gbps CDFP transceiver. During one-hour testing, a red-shift of central wavelength by 0.4-nm corresponding temperature increment of 6.7 degrees C was observed with the brass core assisted cooler module. Such a temperature change was significantly lower than that of 28.3 degrees C for the optical transceiver driven with conventional circuit board. After 100-m distance transmission over a multimode fiber (OM4), the 400-Gbps CDFP transceiver exhibited dispersion penalty of 2.6-dB, power budget of >= 3-dB, link loss of <= 0.63-dB, mask margin of 20%, and bit error rate (BER) of <10(-12) with maintained stability more than one hour. The developed 400-Gbps CDFP transceiver module employing low-power consumption VCSEL and PD arrays, effective coupling lens arrays, and well thermal-dissipation brass metal core is suitable for use in the low-cost and high-performance data center applications.
URI: http://dx.doi.org/10.1038/srep46608
http://hdl.handle.net/11536/145371
ISSN: 2045-2322
DOI: 10.1038/srep46608
期刊: SCIENTIFIC REPORTS
Volume: 7
起始頁: 0
結束頁: 0
Appears in Collections:Articles


Files in This Item:

  1. 970574490413b8ee02fda1ea2e374e7a.pdf