標題: Investigation of Cu/In Thermosonic Bonding
作者: Huang, Yan-Pin
Lu, Shu-Lin
Huang, Yu-Shang
Tseng, Yi-Hsiu
Shu, Min-Fong
Chen, Kuan-Neng
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: Thermonsic Bonding;Three Dimensional Integration;Shear Strength
公開日期: 1-Dec-2017
摘要: In response to the current trend of multi-functional electronic products, integrated circuits become smaller with higher I/O counts. Thermosonic bonding is a potential microelectronic stacking technology for three-dimensional (3D) integration and advanced packaging. Therefore, it is important to comprehend the relation between strength and bonding condition. In this paper, parameters of ultrasonic vibration for low temperature Cu pillar to Cu/In bonding are investigated through shear test. Moreover, electrical performance is evaluated by Kelvin structure and Daisy chain. Experiment results show that heating temperature and bonding force possess a positive correlation with shear strength, which can be up to 39 MPa. In addition, it exhibits good electrical performance in the range of 10(-8) Omega-cm(2) as well as high resistance to environmental degradation. This work provides guidelines of Cu/In thermosonic bonding for future fine pitch applications.
URI: http://dx.doi.org/10.1166/jnn.2017.13872
http://hdl.handle.net/11536/144183
ISSN: 1533-4880
DOI: 10.1166/jnn.2017.13872
期刊: JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY
Volume: 17
起始頁: 8890
結束頁: 8893
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