標題: Intermetallic compounds in 3D integrated circuits technology: a brief review
作者: Annuar, Syahira
Mahmoodian, Reza
Hamdi, Mohd
Tu, King-Ning
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: IMCs;3D-ICs;microbumps;low-volume solder microbumps;Pb-free solder joint
公開日期: 28-Sep-2017
摘要: The high performance and downsizing technology of three-dimensional integrated circuits (3D-ICs) for mobile consumer electronic products have gained much attention in the microelectronics industry. This has been driven by the utilization of chip stacking by throughSi- via and solder microbumps. Pb-free solder microbumps are intended to replace conventional Pb-containing solder joints due to the rising awareness of environmental preservation. The use of low-volume solder microbumps has led to crucial constraints that cause several reliability issues, including excessive intermetallic compounds (IMCs) formation and solder microbump embrittlement due to IMCs growth. This article reviews technologies related to 3D-ICs, IMCs formation mechanisms and reliability issues concerning IMCs with Pb-free solder microbumps. Finally, future outlook on the potential growth of research in this area is discussed.
URI: http://dx.doi.org/10.1080/14686996.2017.1364975
http://hdl.handle.net/11536/143860
ISSN: 1468-6996
DOI: 10.1080/14686996.2017.1364975
期刊: SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
Volume: 18
Issue: 1
起始頁: 693
結束頁: 703
Appears in Collections:Articles


Files in This Item:

  1. 9b28d5acf2b74d66b6bb244c07311e80.pdf