A Study on Purchase Determinants of LCD Driver IC Package Equipment For Taiwan Semiconductor Industry
|關鍵字:||面板驅動IC;紅色供應鏈;AHP層級分析方法;LCD driver IC;Red supply chain;Analytic hierarchy process|
Since the financial crisis in 2008, the semiconductor manufacturers have been relatively conservative in the capital expenditure. The driver IC packaging industry for LCD panel, as compared to the semiconductor front end or advanced packaging in the backend, belongs to an industry of low technical barrier and gross profit. Therefore, for driver IC packaging industry for LCD panel, the price competitive advantage usually comes from equipment depreciation. When the depreciation expense of equipment decreases and the depreciation is finished earlier, the competitive advantage of the sale price will be greatly enhanced. Due to the price war launched by the Korean competitors in the driver IC packaging industry for LCD panel, the gross profit of the manufacturers in Taiwan has dropped greatly or even resulted in a loss. Consequently, the manufacturers have to merge for survival. Meanwhile, Taiwan’s driver IC packaging industry for LCD panel has to face a new threat from the red supply chain. Many companies in China, with the government support, have stepped into the LCD panel industry aggressively. For example, the one-stop shopping model for the LCD panel ecological system, which was set up by Beijing Oriental Electronics (BOE), would issue a big threat to the driver IC design houses and packaging manufacturers in Taiwan. In addition, the reduction in client end demand quantity for notebook PC and tablet PC has also affected the entire panel related industries. To sum up, in order to maintain certain gross profit in the ecology of this system, the purchase and evaluation of equipment should be implemented very cautiously. This study aimed to investigate the deciding factors of the purchase of driver IC packaging equipment for LCD panel in Taiwan’s semiconductor industry. The interview targets mainly included the salespeople, the engineers, the engineering personnel of equipment supplier in the driver IC related industry for LCD panel, the purchase personnel of the manufacturers, and the process and equipment personnel of the manufacturers. Through related literature review and the expert interviews, influential factors were found out in the first place. Then through the importance sorting survey questionnaire of evaluation factors, the evaluation perspective and evaluation factors were constructed. Finally, through analytic hierarchy process (AHP), the weighting of each evaluation perspective and evaluation factor was obtained. It is hoped that the result of this study can be used as reference for the evaluation in the purchase of driver IC packaging industry equipment for LCD panel.
|Appears in Collections:||Thesis|