Applying Analytic Hierarchy Process on Selection of Substrate Suppliers for the IC Assembly Industry in Taiwan
|關鍵字:||IC基板廠商;IC封裝業;層級分析法;供應商評選;IC Substrate supplier;Assembly industry;Analytic hierarchy process;Supplier evaluation|
本研究初步透過文獻回顧整理出24個供應商評選指標，接著透過深入資深實務採購經理進行訪談與問卷調查，建構出選用IC基板供應商關鍵因素第二層的四大構面，依序分別為品質、技術、價格及交期，原24個供應商評選指標則篩選為14個關鍵準則。之後，使用層級分析法 (Analytic Hierarchy Process, AHP)將前述所建構的四大構面及14個關鍵準則透過量化分析綜合評估，得出最終5大重要基板供應商評選參考指標。
By the dawn of 21st century, Taiwanese semiconductor industry has faced various difficult tasks, to work hard on reducing electronic parts’ size, to booster producing efficiency, and to continuously develop new technique for innovation,. and so on. In addition, the uprising strong competitors, red supply chains of China, has brought a new wave of severe competition. The purpose of this research is to assist IC assembling companies to figure out how to choose the best matched supplier to meet all the required qualification in the dimensions of quality, technique, cost and service. In this study, 24 influencing criteria for supplier selection decision were first collected through literature review, and then were developed into four dimensions (quality, technique, price and delivery) and narrowed down to 16 factors by the following experts discussion. The application of analytic Hierarchy Process (AHP) then sorts out the final 5 key dimensions for supplier selection decision. This research finds out that production quality & stability, technology leadership, price, ability for developing new products, and capability of lowering cost are in the order of the most important 5 factors for supplier selection decision. This result is expected to provide a clearly systematic information for IC assembly companies to make wise decisions when they choose substrate suppliers to seek to match their developing strategies of products in the future.