標題: Resist nano-modification technology for enhancing the lithography and etching performance
作者: You, HC
Ko, FH
Lei, TF
材料科學與工程學系奈米科技碩博班
電子工程學系及電子研究所
Graduate Program of Nanotechnology , Department of Materials Science and Engineering
Department of Electronics Engineering and Institute of Electronics
關鍵字: fullerene molecule;electron beam resist;etching;metal silicide
公開日期: 1-Mar-2005
摘要: The fullerene molecules (i.e., C60 and C70) were incorporated in the SUMITOMO NEB-22 negative electron beam resist to investigate the lithographic and etching performances of the resist. The sensitivity, process window and contrast of the modified resist were found to be improved, while the dilution of resist degraded the sensitivity. The electron beam dose affected the designed line width, and the adulterated resist could print sub-50 nm pattern without the problem of line edge roughness. The etching selectivity of gas (CHF3/CF4) on silicon dioxide and resist, and gas (Cl-2/O-2) on poly-silicon and resist were evaluated. We found the small amount (0.01-0.02% w/v) of fullerene molecules very effectively promoted the etch resistance and selectivity. The fullerene-incorporated resist was used to pattern self-aligned metal silicides, and nickel silicide on poly-silicon exhibited lower sheet resistance. (c) 2005 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.mee.2004.12.066
http://hdl.handle.net/11536/13981
ISSN: 0167-9317
DOI: 10.1016/j.mee.2004.12.066
期刊: MICROELECTRONIC ENGINEERING
Volume: 78-79
Issue: 
起始頁: 521
結束頁: 527
Appears in Collections:Conferences Paper


Files in This Item:

  1. 000228589700086.pdf