Title: Microstructural and thermal characterizations of light-emitting diode employing a low-temperature die-bonding material
Authors: Wang, Tzu-Hao
Lee, Hsuan
Chen, Chih-Ming
Chen, Ming-Guan
Hu, Chi-Chang
Chen, Yu-Jie
Horng, Ray-Hua
Department of Electronics Engineering and Institute of Electronics
Keywords: Microstructure;Thermal;Optical;Low-temperature;Die-bonding
Issue Date: Aug-2016
Abstract: A Sn/Bi bilayer was deposited on a hot air solder leveling (HASL)-treated metal-core printed circuit board (MCPCB) using electroplating as a low-temperature die-bonding material for light-emitting diode (LED). The eutectic feature of the Sn/Bi contact enabled the die-bonding process to accomplish through a liquid/solid reaction at 185 degrees C with a proper compression force. A high-temperature die-bonding structure composed of a Bi layer sandwiched by two intermetallic compounds (IMCs) formed after thermocompression. Employment of the Sn/Bi bilayer for low-temperature die-bonding prevented the LEDs from thermal stress problems, and the resulting high-temperature IMC/Bi/IMC die-bonding structure was capable of withstanding multiple bonding reactions and high temperature/current operation environment. Durability tests including mechanical, thermal, and optical performance were systematically performed and compared with other commercially available die-bonding materials (Ag paste and solder alloys). (C) 2016 Elsevier Ltd. All rights reserved.
URI: http://dx.doi.org/10.1016/j.microrel.2016.06.012
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2016.06.012
Volume: 63
Begin Page: 68
End Page: 75
Appears in Collections:Articles