標題: Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization
作者: Huang, CP
Chen, C
Liu, CY
Lin, SS
Chen, KH
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 1-十月-2005
摘要: Nickel has been widely used as an under-bump metallization (UBM) material in the microelectronics industry. The solid-state reaction between the eutectic SnAg solder bumps and three thicknesses of Ni/Cu UBM was investigated, with 5 mu m-Cu/3 mu m-Ni, 3 mu m-Cu/2 mu m-Ni, and 0 mu m-Cu/1 mu m-Ni. It was found that the shear strength of the solder bumps decreased after the solid-state aging at 150 degrees C for 200 h, and it did not change much after it was prolonged for 500 and 1000 h. Aging of the Ag3Sn intermetallic compound (IMC) and grain growth of the solder are responsible for the decrease in the shear strength. Furthermore, the shear test results indicated that the fracture mode switched from ductile to brittle for the solder bumps with 1 mu m Ni after aging longer than 200 h, causing the strength of the solder to decrease abruptly. This is attributed to the consumption of the peripheral Ni layer after the solid-state aging for 1000 It. The Ni consumption rate was measured to be 0.02 mu m/h(1/2) at 150 degrees C.
URI: http://dx.doi.org/10.1557/JMR.2005.0334
http://hdl.handle.net/11536/13221
ISSN: 0884-2914
DOI: 10.1557/JMR.2005.0334
期刊: JOURNAL OF MATERIALS RESEARCH
Volume: 20
Issue: 10
起始頁: 2772
結束頁: 2779
顯示於類別:期刊論文


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  1. 000232459000024.pdf