Full metadata record
DC FieldValueLanguage
dc.contributor.authorLee, Hsiao-Wenen_US
dc.contributor.authorLin, Bor-Shyhen_US
dc.date.accessioned2015-12-02T02:59:28Z-
dc.date.available2015-12-02T02:59:28Z-
dc.date.issued2015-10-01en_US
dc.identifier.issn1559-128Xen_US
dc.identifier.urihttp://dx.doi.org/10.1364/AO.54.00E210en_US
dc.identifier.urihttp://hdl.handle.net/11536/128248-
dc.description.abstractAn advanced, ultra-thin, flexible LED (FLED) package technique is first proposed in this study, where a polyimide substrate was used as the lead frame package material due to its physical stability in thermal processing. The experimental results showed that the thickness of the mockup sample measured by a vernier caliper was 260 mu m and 35% thinner than the Panasonic organic LED lighting panel announced on 4 March 2014 in Tokyo. Moreover, the flexible angle of the ultra-thin LED package was 200.54 degrees when it surrounded a disk with a 1 cm radius. A design of a micro-lens array manufactured by silicone molding on the FLED is also proposed in this study. Finally, different types of micro-lenses were applied to different lighting regions to investigate their lighting effects. (C) 2015 Optical Society of Americaen_US
dc.language.isoen_USen_US
dc.titleMicro-lens array design on a flexible light-emitting diode package for indoor lightingen_US
dc.typeArticleen_US
dc.identifier.doi10.1364/AO.54.00E210en_US
dc.identifier.journalAPPLIED OPTICSen_US
dc.citation.volume54en_US
dc.citation.issue28en_US
dc.citation.spageE210en_US
dc.citation.epageE215en_US
dc.contributor.department光電系統研究所zh_TW
dc.contributor.department光電工程學系zh_TW
dc.contributor.departmentInstitute of Photonic Systemen_US
dc.contributor.departmentDepartment of Photonicsen_US
dc.identifier.wosnumberWOS:000362237300033en_US
dc.citation.woscount0en_US
Appears in Collections:Articles