標題: High-efficiency and low assembly-dependent chip-scale package for white light-emitting diodes
作者: Huang, Che-Hsuan
Chen, Kuo-Ju
Tsai, Ming-Ta
Shih, Min-Hsiung
Sun, Chia-Wei
Lee, Wei-I
Lin, Chien-Chung
Kuo, Hao Chung
光電系統研究所
光電工程學系
Institute of Photonic System
Department of Photonics
關鍵字: light-emitting diode;phosphor;chip-scale;lighting;backlight unit
公開日期: 21-Apr-2015
摘要: This article presents a chip-scale package (CSP) with conformal and uniform structures for white light-emitting diodes used in lighting and backlight unit (BLU) applications. The CSP structures produce higher light extraction efficiency and lower assembly-dependent packaging compared with conventional surface-mounted devices (SMDs). Simulation results show that compared with SMDs, the luminous efficiency of CSP structures is 8.81% higher in lighting applications and 9.43% higher in BLU applications. This is likely due to light loss in the light bowl of the SMDs. Moreover, CSPs with a conformal phosphor structure exhibit low assembly dependence and redundancy, and rb-CSPs with a conformal structure are a more effective light source in both lighting and BLU applications. (C) 2015 Society of Photo-Optical Instrumentation Engineers (SPIE)
URI: http://dx.doi.org/10.1117/1.JPE.5.057606
http://hdl.handle.net/11536/127933
ISSN: 1947-7988
DOI: 10.1117/1.JPE.5.057606
期刊: JOURNAL OF PHOTONICS FOR ENERGY
Volume: 5
起始頁: 0
結束頁: 0
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