標題: 2.5D Heterogeneously Integrated Microsystem for High-Density Neural Sensing Applications
作者: Huang, Po-Tsang
Wu, Shang-Lin
Huang, Yu-Chieh
Chou, Lei-Chun
Huang, Teng-Chieh
Wang, Tang-Hsuan
Lin, Yu-Rou
Cheng, Chuan-An
Shen, Wen-Wei
Chuang, Ching-Te
Chen, Kuan-Neng
Chiou, Jin-Chern
Hwang, Wei
Tong, Ho-Ming
交大名義發表
National Chiao Tung University
關鍵字: Analog front-end (AFE);configurable discrete wavelet transform (DWT);low-power ADC;neural sensing microsystem;on-interposer bus;through-silicon-via (TSV);2.5D heterogeneous integration;mu-probes
公開日期: 1-十二月-2014
摘要: Heterogeneously integrated and miniaturized neural sensing microsystems are crucial for brain function investigation. In this paper, a 2.5D heterogeneously integrated bio-sensing microsystem with mu-probes and embedded through-silicon-via (TSVs) is presented for high-density neural sensing applications. This microsystem is composed of mu-probes with embedded TSVs, 4 dies and a silicon interposer. For capturing 16-channel neural signals, a 24 x 24 mu-probe array with embedded TSVs is fabricated on a 5 x 5 mm2 chip and bonded on the back side of the interposer. Thus, each channel contains 6 x 6 mu-probes with embedded TSVs. Additionally, the 4 dies are bonded on the front side of the interposer and designed for biopotential acquisition, feature extraction and classification via low-power analog front-end (AFE) circuits, area-power-efficient analog-to-digital converters (ADCs), configurable discrete wavelet transforms (DWTs), filters, and a MCU. An on-interposer bus (mu-SPI) is designed for transferring data on the interposer. Finally, the successful in-vivo test demonstrated the proposed 2.5D heterogeneously integrated bio-sensing microsystem. The overall power of this microsystem is only 676.3 mu W for 16-channel neural sensing.
URI: http://dx.doi.org/10.1109/TBCAS.2014.2385061
http://hdl.handle.net/11536/124266
ISSN: 1932-4545
DOI: 10.1109/TBCAS.2014.2385061
期刊: IEEE TRANSACTIONS ON BIOMEDICAL CIRCUITS AND SYSTEMS
起始頁: 810
結束頁: 823
顯示於類別:期刊論文


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