Title: Interfacial reactions between Cu and SnAgCu solder doped with minor Ni
Authors: Cheng, Hsi-Kuei
Huang, Chin-Wen
Lee, Hsuan
Wang, Ying-Lang
Liu, Tzeng-Feng
Chen, Chih-Ming
Department of Materials Science and Engineering
Institute of Lighting and Energy Photonics
Keywords: Ni;Microstructure;Grain size
Issue Date: 15-Feb-2015
Abstract: The interfacial reactions between Cu and SnAgCu-based solders were investigated. Two types of SnAgCu-based solders were used, one was Sn-1.0Ag-0.5Cu (SAC105) and the other was Sn-1.2Ag-0.5Cu-0.05Ni (LF35), where the composition was in wt.%. The addition of Ni in the SnAgCu-based solder was found to have significant effects on the morphological evolution and growth of the Cu6Sn5 and Cu3Sn phases formed at the solder/Cu interfaces. At the Ni-added LF35/Cu interface after liquid/solid reaction at 260 degrees C,the Cu6Sn5 phase presented a microstructure with a much smaller grain size. During subsequent solid/solid reaction at 150 and 200 degrees C, the growth of the Cu6Sn5 phase was significantly enhanced at the LF35/Cu interface but that of the Cu3Sn phase was inhibited. A potential mechanism was proposed to explain the effects of Ni addition on the solder/Cu interfacial reactions. (C) 2014 Elsevier B. V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.jallcom.2014.10.121
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2014.10.121
Volume: 622
Begin Page: 529
End Page: 534
Appears in Collections:Articles