Title: Quartz resonator assembling with TSV interposer using polymer sealing or metal bonding
Authors: Shih, Jian-Yu
Chen, Yen-Chi
Chiu, Chih-Hung
Lo, Chung-Lun
Chang, Chi-Chung
Chen, Kuan-Neng
Department of Electronics Engineering and Institute of Electronics
Keywords: Three-dimensional (3D) integration;Through-silicon via (TSV);Wafer thinning;Sealing bonding
Issue Date: 1-Oct-2014
Abstract: This paper presents one wafer level packaging approach of quartz resonator based on through-silicon via (TSV) interposer with metal or polymer bonding sealing of frequency components. The proposed silicon-based package of quartz resonator adopts several three-dimensional (3D) core technologies, such as Cu TSVs, sealing bonding, and wafer thinning. It is different from conventional quartz resonator using ceramic-based package. With evaluation of mechanical structure design and package performances, this quartz resonator with advanced silicon-based package shows great manufacturability and excellent performance to replace traditional metal lid with ceramic-based interposer fabrication approach.
URI: http://dx.doi.org/10.1186/1556-276X-9-541
ISSN: 1556-276X
DOI: 10.1186/1556-276X-9-541
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