標題: Modal Analysis of Substrate Integrated Waveguides With Rectangular Via-Holes Using Cavity and Multilayer Green\'s Functions
作者: Kehn, Malcolm Ng Mou
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
關鍵字: Green's function;moment method;spectral-domain technique;substrate integrated waveguide (SIW)
公開日期: 1-十月-2014
摘要: The substrate integrated waveguide (SIW) comprising rectangular via-holes is herein treated by a rigorous full-wave modal analysis using the moment method entailing Green\'s functions for rectangular cavities and planar multilayer structures in the spectral domain. Modal dispersion graphs generated by this solution approach are compared with those obtained by an independent commercial full-wave solver. The ability of the modal solution in treating SIW junctions and discontinuities is demonstrated by the treatment of an interconnection between a conventional waveguide and a SIW using the mode-matching technique. Inhomogeneities within SIWs can also be accommodated by the technique, as showcased by a specific example of the so-called hard sidewalled SIW. Three avenues of losses, namely, dielectric, side-leakage, and conductor losses, are also investigated, thereby elucidating a tradeoff between the latter two.
URI: http://dx.doi.org/10.1109/TMTT.2014.2344626
http://hdl.handle.net/11536/123976
ISSN: 0018-9480
DOI: 10.1109/TMTT.2014.2344626
期刊: IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
Volume: 62
Issue: 10
起始頁: 2214
結束頁: 2231
顯示於類別:期刊論文


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  1. 000344990600002.pdf