標題: Fast phase transformation due to electromigration of 18 mu m microbumps in three-dimensional integrated-circuit integration
作者: Chang, Y. W.
Chen, Chih
Chang, T. C.
Zhan, C. J.
Juang, J. Y.
Huang, Annie T.
材料科學與工程學系
Department of Materials Science and Engineering
關鍵字: Phase transformation;Metallic composites;Intermetallic compound;Solder;Electromigration
公開日期: 15-十二月-2014
摘要: The electromigration behavior was investigated in 18-mu m SnAg microbumps at 150 degrees C. The monitored resistance increase abruptly soon after the current stressing of 4.6 x 10(4) A/cm(2) was applied but the resistance rose much slower after a certain period of time. The formation of the high-resistivity Ni3Sn4 intermetallic compounds (IMCs) was responsible for the abrupt resistance increase in the beginning of the current stressing. The whole solder joint was transformed into an IMC joint. Because IMC has a higher electromigration resistance than the solder, a much slower increase in resistance was resulted after the solder joint was transformed into IMCs. (C) 2014 Elsevier B.V. All rights reserved.
URI: http://dx.doi.org/10.1016/j.matlet.2014.08.156
http://hdl.handle.net/11536/123861
ISSN: 0167-577X
DOI: 10.1016/j.matlet.2014.08.156
期刊: MATERIALS LETTERS
Volume: 137
起始頁: 136
結束頁: 138
顯示於類別:期刊論文


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  1. 000345469700037.pdf