標題: INTERCONNECTING STRUCTURE FOR ELECTRICALLY CONNECTING A FIRST ELECTRONIC DEVICE WITH A SECOND ELECTRONIC DEVICE
作者: Li Chun-Hsing
Kuo Chien-Nan
Ko Chun-Lin
公開日期: 12-Mar-2015
摘要: An interconnecting structure for electrically connecting a first electronic device with a second electronic device is provided. The first electronic device has two first bond-pads, and the second electronic device has two second bond-pads electrically connected to the two first bond-pads respectively. The interconnecting structure includes a signal transmission structure electrically connected to the two first bond-pads and the two second bond-pads; and a ground device disposed between the first electronic device and the second electronic device so that the first electronic device and the second electronic device have a same ground potential.
官方說明文件#: H01P003/08
URI: http://hdl.handle.net/11536/122862
專利國: USA
專利號碼: 20150068024
Appears in Collections:Patents


Files in This Item:

  1. 20150068024.pdf