標題: Critical length of electromigration for eutectic SnPb solder stripe
作者: Wei, CC
Chen, C
材料科學與工程學系
Department of Materials Science and Engineering
公開日期: 1-May-2006
摘要: The critical length of eutectic SnPb solder was investigated using solder stripes. By employing focus ion beam, solder stripes of various lengths, including 5, 10, 15, 20, 30, 100, and 200 mu m, can be fabricated. Length-dependent electromigration behavior was observed, which implies that there may be back stress under stressing. The critical length was determined to be between 10 and 15 mu m under stressing by 2x10(4) A/cm(2) at 100 degrees C, and the corresponding critical product was between 20 and 30 A/cm. Both values show good agreement with their theoretical values. (c) 2006 American Institute of Physics.
URI: http://dx.doi.org/10.1063/1.2200158
http://hdl.handle.net/11536/12269
ISSN: 0003-6951
DOI: 10.1063/1.2200158
期刊: APPLIED PHYSICS LETTERS
Volume: 88
Issue: 18
結束頁: 
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