|Title:||Epoxy/polyhedral oligomeric silsesquioxane nanocomposites from octakis(glycidyidimethylsiloxy)octasilsesquioxane and small-molecule curing agents|
Department of Applied Chemistry
|Keywords:||curing of polymers;nanocomposites;silicons;crosslinking|
|Abstract:||Epoxy/polyhedral oligomeric silsesquioxane (POSS) nanocomposites were obtained from octakis(glycidyldimethylsiloxy)octasilsesquioxane (OG) and diglycidyl ether of bisphenol A cured with small-molecule curing agents of diethylphosphite (DEP) and dicyandiamide (DICY). An increase in the POSS contents of the nanocomposites and an improvement in the nanocomposite homogeneity were observed with the use of the small-molecule curing agents. Phosphorus in DEP and nitrogen in DICY also performed synergism with POSS for thermal stability enhancement and flammability improvement in the nanocomposites. The nanocomposites possessing high OG contents exhibited good thermal stability, improved flammability, and high storage moduli. (c) 2006 Wiley Periodicals, Inc.|
|Journal:||JOURNAL OF POLYMER SCIENCE PART A-POLYMER CHEMISTRY|
|Appears in Collections:||Articles|
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